On June 11, Penn State researchers introduced the world’s first non-silicon computer 2D computer graphics system, developed entirely of atom-thin materials, to transform chip design, allowing faster, and more efficient processors.
In a milestone that could rewrite the book on electronics in the new century, researchers at Penn State have built what they call the next-generation computer chips, a functional computer made entirely of two-dimensional materials. They are one atom thick but still have their electronic properties; something silicon can’t manage to do when it gets that small.
The study was supported by the US National Science Foundation, Army Research Office, and Office of Naval Research and used resources available through the 2D Crystal Consortium Materials Innovation Platform at Penn State. The researchers’ observations on 2D computer graphics may mark the beginning of a new computing era, one in which wafer-thin processors redraw technology limits.
2D Computer Graphics in Chip Design
Published in Nature, the research is a breakthrough in 2D semiconductors – something scientists have long considered the key to maintaining Moore’s Law.
In using a complementary metal-oxide semiconductor (CMOS) design, the same foundation for most modern devices, researchers created a silicon-free system capable of performing basic logic functions.
CMOS design is a method for constructing integrated circuits, using a complementary and symmetrical pair of p-type and n-type metal-oxide-semiconductor field-effect transistors (MOSFETs) for logic functions – primary reason for its characteristically low power consumption.
“Silicon has driven remarkable advances in electronics for decades by enabling continuous miniaturization of field-effect transistors (FETs),” said Saptarshi Das, the Ackley Professor of Engineering who led the research.
To accomplish this, the team used se-mediated dry transfer 2D semiconductors, a production method that allows for accurate layering of materials without degrading their atomic structure. It was achieved in ultra-thin, high-performance circuits that could serve as the building blocks of tomorrow’s chips.
The research also illustrates early success in flexible electronics computer systems, that could be integrated into wearable technology, rolling screens, or light-weight industrial sensors. Because 2D materials are strong and flexible, they open the door to electronics that could function at temperatures where silicon would fail or break.
The research is directed towards the future field of two-dimensional materials computing where ultra-thin materials like molybdenum disulfide and tungsten selenide are used to supplant silicon transistors.
The compounds form the n-type and p-type transistors required for CMOS technology – a combination deemed impossible to achieve without silicon.
“That’s the key advancement of our work,” Das said. “We have demonstrated, for the first time, a CMOS computer built entirely from 2D materials.”
The world’s first 2D computer can perform the same simple functions as silicon chips, though at a smaller scale and much lower energy cost.
2D Non-Silicon Computer Fueling a Low-Power Future
The prototype’s processing is small, reaching speeds of about 25 kilohertz while using minimal power.
According to lead author, Subir Ghosh, and Penn State doctoral student, the computer operates at low voltages with low power consumption. The efficiency here makes it suitable for non-silicon computer systems where longevity and sustainability are more important than brute speed.
The team used a scalable 2D semiconductor production fabrication method, synthesizing large-area sheets of tungsten diselenide and molybdenum disulfide via metal-organic chemical vapor deposition (MOCVD). Optimizing each step, they made over 1,000 of each kind of transistor, highlighting how integration of 2D material can be scaled up.
Experts also demonstrated wafer-scale 2D integration, a key milestone to producing chips with thousands of 2D transistors on an industrial scale. With advancement in manufacturing techniques, this approach could make it possible for industry to make smaller devices with more computing density.
Their work carries high promise for low-power computing, especially in gadgets that need to compute data locally, such as drones, edge AI chips, or smart sensors, without drawing much power.
“Silicon technology has been refined for nearly 80 years, while 2D materials have only been studied since about 2010,” Das said that while 2D material research is still in its early stages, progress is rapid.
The breakthrough is also a significant leap towards post-silicon electronics, a new branch that seeks to discover green substitutes for the usual chip materials.
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