SEOUL, Jan 26 (Reuters) - Samsung Electronics plans to start production of its next-generation high-bandwidth memory (HBM) chips, or HBM4.
HBM4 chips
SEOUL, Jan 2 (Reuters) - Samsung Electronics customers have praised the differentiated competitiveness of its next-generation high-bandwidth memory.
Samsung, traditionally a memory chips’ leader, has fallen behind South Korean rival SK Hynix in the flourishing HBM market
memory chip maker SK Hynix to bring forward by six months the supply of its next-generation high-bandwidth memory chips
