xMEMS’s Ultrasonic Earbuds Move Beyond Sound Restrictions
In the consumer electronics market, a seismic shift is about to take place, introducing a new age in audio technology, led by one startup xMEMS and its creation of ultrasonic earbuds.
The startup is moving beyond the archaic restrictions of traditional headphone design and taking the world of consumption into a future where sound is not just heard but felt in multidimensional clarity.
A Tiny but Mighty Chip
A key element in this creation is the Cypress micro-speaker, a newly engineered audio chip, barely the size of a dime, to orchestrate our way into the sound of the future through the power of ultrasonic waves to deliver a new audio experience.
What lacked in conventional audio technology, reliant on the movement of air through mechanical means, is present in precision and durability offered by Cypress’s silicon-based design. What consumers perceived as flaws in traditional speakers, such as susceptibility to damage, distortion, and the wear and tear of moving parts, will all be evaded by xMEMS’s new ultrasonic approach.
The startup is employing an application-specific integrated circuit (ASIC)—customized for a particular use instead of general-purpose use—paired with an ultrasonic transducer, enabling the Cypress chip to convert electrical signals into sound waves using the piezoelectric effect, a phenomenon where certain materials move or change shape when an electric current is applied.
This not only enhances sound quality but also reduces the risk of phase distortion, a common issue that impairs the audio output of conventional speakers.
What sets the Cypress chip apart…
xMEMS is using micro-electromechanical systems (MEMS)—tiny machines that integrate electronic and mechanical components. Unlike the piezoelectric crystals or ceramics used in most MEMS, Cypress utilizes a class of thin piezoelectric films made from lead zirconate titanate (PZT) to allow for the production of sound with exceptional resolution and quality.
With its near-zero phase shift and the ability to generate air pressure at unique levels, the Cypress chip is suited for advanced noise-canceling capabilities and spatial audio, creating a new sound experience that simulates being enveloped by speakers from multiple directions.
Let’s Talk Market Competitiveness
Let’s just say it as it is. For a while now, Bose has managed to take the lead in noise-canceling technology for earbuds, with its QuietComfort Earbuds II remaining a consumer favorite. But xMEMS’s marketing competition against Bose’s QuietComfort technology not only challenges the current market leaders like Bose, known for their noise-canceling expertise but also sets the stage for future development of auditory technologies.
As We Look to the Future
The route of xMEMS and its ultrasonic technology is abundantly clear, with a production-ready version of the Cypress chip set to be released in mid-2024 and mass production anticipated to commence shortly thereafter.
Yet, the fate of this technology remains a tantalizing, tempting question: Will xMEMS materialize into a giant in the earbuds market, or will its technology be assimilated by one of the industry’s already dominating titans?
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