3D WiFi Will Kill the Categorization of Smart Cities

Say goodbye to internet congestion with 3D WiFi, as it introduces three-dimensional processor is transforming wireless communication.

University of Florida researchers have developed a new solution for the internet congestion problem with the creation of 3D WiFi, a three-dimensional processor set to completely change wireless communication.

We’ve all been stuck in situations where we are endlessly refreshing the feed of our favorite social media app, or trying to get some work done but that one page just isn’t loading.

The root cause? Too many users trying to squeeze the connection all at once, decreasing cell phone towers’ capability to handle the influx. When the user count increases, the capacity decreases. It’s just basic math, and it is no surprise that this is the most applicable rule in the field of technology. And the upcoming AI wave, set to disrupt the digital landscape as we know it, will definitely further increase the pressure on said cell towers and their connection with your smart devices.

So, these researchers decided to come up with a small, simplistic solution to a far more complex problem: why not just make the chips 3D and assess how this would affect wireless communication?

A Little Background

Just to give some contextual background into the technology itself, in order to present a coherent picture of the reality that led to the development of these 3D chips, we’ll need to get into some of the nitty-gritty details of our wireless communications.

Most communications rely on what is known as “planar” processors – a flat computer chip that operates on a single level, handling data on a two-dimensional level. Due to its nature, this type of chip can handle a limited range of frequencies at a certain period.

If we are to completely shift our manufacturing power towards 3D WiFi chips, then we’re talking about a future where these tiny chips will enable hardware to simultaneously handle multiple frequencies. In respect, this will unlock a new chip power capacity to carry the AI future on its shoulders, facilitate internal communication between multiple smart devices, and in some cases, support smart cities. It seems only fair given semiconductors are the backbone of all our present-day technologies.

Smart to Cognitive, to Systematized Communication

The materialization of 3D WiFi could seriously support the infrastructure of smart cities, transforming them into more efficient metropolises of data collection and connectivity. The genesis of 3D WiFi chips can support a greater volume and variety of connected devices, nourishing an unflawed integration of various urban systems. As cities become more interconnected, 3D WiFi will open doors for cognitive cities’ infrastructure to be immaculately molded, where it not only collects but also processes and acts upon data intelligently, in support of the rise of AI.

This dynamic adaptation would improve urban living by making it more responsive to the residents’ needs and environmental changes.

With this 3D semiconductor technology and WiFi, we are looking at a potential drastic shift from smart cities to cognitive cities. Naturally, considering their nature and hunger for data, the predominantly increased data handling and processing capabilities of 3D chips could enable these futuristic urban areas to autonomously learn from and adapt to their inhabitants’ needs with almost zero effort.

This one will harness significant communicative power.

We’re talking about the inception of economically connected environments that can predict and self-evolve at a speed and in a manner we have yet to witness. 3D WiFi will smooth the path for new technologically advanced and intellectually capable cities that will also predictively self-evolve synchronically. All this, not just supported but rather incepted by a tiny 3D WiFi chip enabling the analysis of vast data streams to create a responsive urban system.

There you have it. Connectivity of the future.

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